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- This Nexus server solution will
provide you the best and most efficient cooling possible in the server
cooler market. By using SkiveTek technology and 99.5% pure copper
material you have the best characteristics for the best possible
efficiency and cooling. All server coolers are designed and manufactured
with the utmost care and precision for high-end and vital servers.
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- Perfect Server Solutions!
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Features
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Thess Nexus server solutions are
manufactured using SkiveTek® technology SkiveTek®
technology allows us to produce high fin density and it even allows us
to determine the perfect fin pitch and fin thickness to match the
requirements of the specific processor. |
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The Nexus server solutions are
manufactured out of 99.5% pure copper material. This practically
pure copper material is highly efficient in transfering heat allover the
heatsink and provide the best possible dissipation and cooling |
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The passive, fanless server solutions are
designed to operate in an environment with a good thermal/cooling
structure. Although the cooler is passive it does require an amount of
airflow to go through the fins to be able to provide the neccessary
cooling. So the fins of the passive server cooler should be inline with
the airflow direction in the case for optimal performance. |
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The server cooler models displayed on this
page are designed for AMD Socket F (1207) use. The neccesary backplate
and high performance thermal paste is supplied with the cooler. |
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Specifications: |
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- Model number: SFP-7424 |
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- AMD Socket F 1207, EATX |
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- 1U, size: 100x74x24mm |
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- Fins of 100mm wide - paralel
(Important for airflow lauout!) |
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- Fin pitch: 2.1mm |
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- Fin thickness: ~0.68mm |
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- Passive heat sink |
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- Full copper, 99.5% pure, C1020 copper
material |
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- Thermal resistance: 0.232°C/W |
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- Weight: 654 gram |
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- including backplate and thermal grease |
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- Complies to WEEE & RoHS environment
directives |
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| High resolution
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Specifications: |
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- Model number: SFP-1224 |
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- AMD Socket F 1207, EATX |
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- 1U, size: 100x74x24mm |
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- Fins of 74mm wide - vertical
(Important for airflow lauout!) |
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- Fin pitch: 2.0mm |
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- Fin Thickness: ~0.53mm |
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- Passive heat sink |
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- Full copper, 99.5% pure, C1020 copper
material |
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- Thermal resistance: 0.226°C/W |
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- Weight: 664 gram |
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- including backplate and thermal grease |
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- Complies to WEEE & RoHS environment
directives |
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| High resolution
image: |
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Specifications: |
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- Model number: SFP-1207 |
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- AMD Socket F 1207 |
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- 1U, size: 114x70x25mm |
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- Fins of 114mm wide (Important
for airflow lauout!) |
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- Fin pitch: 1.5mm |
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- Fin thickness: ~0.4mm |
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- Passive heat sink |
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- Full copper, 99.5% pure, C1020 copper
material |
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- including backplate and thermal grease |
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- Complies to WEEE & RoHS environment
directives |
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| High resolution
image: |
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Specifications: |
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- Model number: SFP-2207 |
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- AMD Socket F 1207 |
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- 1U, size: 114x70x25mm |
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- Fins of 70mm wide (Important
for airflow lauout!) |
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- Fin pitch: 1.5mm |
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- Fin thickness: ~0.4mm |
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- Passive heat sink |
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- Full copper, 99.5% pure, C1020 copper
material |
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- including backplate and thermal grease |
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- Complies to WEEE & RoHS environment
directives |
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| High resolution
image: |
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Specifications: |
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- Model number: SFP-3207 |
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- AMD Socket F 1207, EATX |
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- 1U, size: 100x74x24mm |
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- Fins of 100mm wide -
paralel (Important for airflow lauout!) |
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- Fin pitch: 1.5mm |
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- Fin thickness: ~0.3mm |
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- Passive heat sink |
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- Full copper, 99.5% pure, C1020 copper
material |
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- including backplate and thermal grease |
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- Complies to WEEE & RoHS environment
directives |
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| High resolution
image: |
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Specifications: |
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- Model number: SFP-4207 |
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- AMD Socket F 1207, EATX |
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- 1U, size: 100x74x24mm |
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- Fins of 74mm wide -
vertical (Important for airflow lauout!) |
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- Fin pitch: 1.45mm |
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- Fin thickness: ~0.3mm |
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- Passive heat sink |
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- Full copper, 99.5% pure, C1020 copper
material |
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- including backplate and thermal grease |
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- Complies to WEEE & RoHS environment
directives |
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| High resolution
image: |
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Reviews and customer feedback |
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Send us your feedback...mail to:
info@nexustek.nl |
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